MG Chemicals 4900P, Lead Free Solder Paste, SAC305, No-Clean 

4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Repeatable and consistent printing characteristics
• Long stencil and tack life facilitate high speed printing
• Excellent wettability
• Suitable for air or nitrogen atmospheres
• Medium-soft, non-cracking residues

Technical Data Sheet

Safety Data Sheet

*Keep Refrigerated