Indium NC-SMQ92J - 63/37 Tin-Lead No-Clean Solder Paste 500g (MOQ: 8)

Premium no-clean eutectic solder paste for high-volume SMT assembly. Indium NC-SMQ92J is a high-performance tin-lead solder paste formulated with the eutectic 63/37 alloy (Indalloy 106) and no-clean flux for electronics manufacturing. This Type 3 powder solder paste delivers excellent print definition, tack time, and solder joint reliability with minimal post-reflow residue.

PRODUCT SPECIFICATIONS
• SKU: PASTEOT-82453-500G
• Alloy: 63/37 (63% Tin / 37% Lead) - Eutectic (Indalloy 106)
• Powder Size: Type 3 (25-45 micron)
• Flux Type: No-Clean
• Package Size: 500 gram jar
• Minimum Order Quantity: 8 jars
• Shelf Life: 6 months refrigerated (2-10°C)
• Manufacturer: Indium Corporation

KEY FEATURES & BENEFITS
✓ No-Clean Flux - Minimal post-reflow residue, no cleaning required
✓ Eutectic Alloy - Sharp 183°C melting point for consistent results
✓ Excellent Print Definition - Type 3 powder for fine-pitch components
✓ Extended Tack Time - Maintains component placement stability
✓ Superior Wetting - Consistent solder joint formation
✓ Wide Process Window - Forgiving reflow profile tolerance

IDEAL APPLICATIONS
• High-volume SMT assembly
• Fine-pitch components (0402, 0603, 0805)
• Ball grid array (BGA) packages
• Chip-scale packages (CSP)
• Military, aerospace, and medical electronics (where lead exemptions apply)
• Legacy electronics manufacturing

MINIMUM ORDER QUANTITY
This product has a minimum order quantity of 8 jars (500g each) = 4.0kg total. Ensures fresh product and optimal performance for production environments.

COMPLIANCE NOTES
• Contains Lead: Not RoHS compliant
• Suitable for: Military, aerospace, medical (where exemptions apply)
• J-STD-004 & J-STD-005 Tested - IPC industry standards